Method of reducing charging damage to integrated circuits during semiconductor manufacturing

ABSTRACT

A semiconductor substrate having an integrated circuit die area surrounded by a scribe lane is provided. Within the integrated circuit die area, a first trench isolation region and a second trench isolation region are formed on the semiconductor substrate, wherein the first trench isolation region isolates a first active device region from a second active device region, and the second trench isolation region comprises a plurality of trench dummy features for reducing loading effect. A first gate electrode is formed on the first active device region and a second gate electrode on the second active device region. The first active device region is masked, while the second active device region and the trench dummy features are exposed. An ion implantation process is then performed to implant dopant species into the second active device region.

BACKGROUND OF INVENTION

1. Field of the Invention

The present invention relates generally to the field of semiconductorfabrication and, more particularly, to a method of reducing chargingdamage to integrated circuits during semiconductor manufacturing. Thepresent invention is particularly suited for ion implant processing inan ion implanter without employing a plasma flood system.

2. Description of the Prior Art

Ion implanters and ion implant process are commonly used in themanufacture of semiconductor products for implanting dopant species intowafers or semiconductor substrates to change the conductivity of thematerial in such substrates. Ion implanters generally comprise an ionsource for generating a beam of ions, a mass analyzer for selecting aparticular species of ions from the ion beam and means to direct themass-selected ion beam through a vacuum chamber onto a target substratesupported on a substrate holder. A high-current ion implanter usuallyencompasses a plasma flood system used to neutralize positive ions.

Influence of ion implant process on wafers has been investigated. It hasbeen revealed that when processing a wafer in plasma ambient or ionimplant process environment, charging damage occurs due to surfacecharge build-up. Such charging damage to integrated circuits can resultin costly losses of product.

Typically, damage to thin insulators such as gate oxide sandwichedbetween a conductive substrate and isolated conductive electrodes on thesurface of a wafer (gates) occurs due to current flow through theinsulator, driven by a potential difference between the surfaceelectrode and the substrate. During wafer processing, wafer-scalepotential differences are caused by global non-uniformities in plasmadensity and/or electron temperature or, in the case of ion-beamequipment, by spatially imperfect neutralization of the charging causedby the ion beam.

When devices are under the beam in a high-current ion implanter, theyare exposed to positive charging from the high-energy ion beam, from“slow” ions (ionized background gases or the plasma used for chargeneutralization), and from secondary electrons emitted from the surfaceof the wafer due to ionic impact. They are also exposed to negativecharging from the “electron shower” or the plasma electrons from aplasma flood system used to neutralize positive charging. Therefore, thenet positive charging when devices are under the beam is the sum of thepositive and negative charging.

Lukaszek in U.S. Pat. No. 5,998,282 describes a method of reducingcharging damage to integrated circuits in ion implant and plasma-basedintegrated circuit process equipment. Charging damage to integratedcircuits during ion implantation and plasma processing of integratedcircuit die in a semiconductor wafer is reduced by processing scribelanes during wafer fabrication to facilitate the flow of current to andfrom the wafer substrate through the scribe lanes during integratedcircuit fabrication and reduce current flow through integrated circuitcomponents. Lukaszek also reveals that increasing shunt path currentflow within the integrated circuit die is difficult due to circuitlayout constraints.

SUMMARY OF INVENTION

It is the primary object of the present invention to provide an improvedmethod of reducing charging damage to integrated circuits duringsemiconductor manufacturing, wherein the difficulty of increasing shuntpath current flow within the integrated circuit die is overcome.

In accordance with the claimed invention, a method of reducing chargingdamage to integrated circuits during semiconductor manufacturing isdisclosed. A semiconductor substrate comprising thereon a number ofintegrated circuit dies is provided. The integrated circuit dies areseparated from each other by scribe lanes surrounding each integratedcircuit die. Each integrated circuit die comprises thereon at least afirst device region, a second device region and a trench isolation dummyregion. A first implant mask is formed over the semiconductor wafer, thefirst implant mask covers the second device region and the trenchisolation dummy region, while exposing the semiconductor substratewithin the second device region. Dopant species are implanted into theexposed semiconductor substrate within the first device region to formfirst doping regions therein. The first implant mask is stripped off. Asecond implant mask is formed over the semiconductor wafer. The secondimplant mask covers the first device region, while exposing thesemiconductor substrate within the first device region and a pluralityof trench dummy features of the trench isolation dummy region. Dopantspecies are implanted into the exposed semiconductor substrate withinthe second device region to form second doping regions therein.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention. In the drawings:

FIG. 1 is a schematic plan view of layout of a photoresist implant maskfor implementing lightly doped drain (LDD) regions of high-voltagedevices in an integrated circuit die;

FIG. 2 is a schematic plan view of layout of a photoresist implant maskfor implementing LDD regions of high-voltage devices in an integratedcircuit die according to one preferred embodiment of the presentinvention; and

FIGS. 3–6 are schematic, cross-sectional diagrams showing the method ofreducing charging damage to integrated circuits during semiconductormanufacturing in accordance with the preferred embodiment of the presentinvention.

DETAILED DESCRIPTION

In describing the preferred embodiment of the present invention,reference will be made herein to FIGS. 1–2 of the drawings. Features ofthe invention are not drawn to scale in the drawings.

As previously described, high-current ion implanters are typicallyequipped with a plasma flood gun, which is an effective apparatus forsuppressing positive charging of wafer. In some cases, however, the ionimplanter is not equipped or operated with such plasma flood gun, forexample, a medium-current ion implanter that is generally used toprovide a dosage of about 1E11˜1E14 atoms/cm² and ion implant energy ofabout 10 KeV˜500 KeV. Such medium-current ion implanters are typicallyemployed to form lightly doped source/drain doping regions in thesubstrate.

FIG. 1 is a schematic plan view of layout of a photoresist implant mask20 for implementing lightly doped drain (LDD) regions of high-voltagedevices in an integrated circuit die. As shown in FIG. 1, the integratedcircuit die 10 is surrounded with scribe lanes 12. A number of test keyregions (not explicitly shown) are defined within the scribe lanes 12.Within the integrated circuit die 10, device ion wells, gate oxidelayer, polysilicon gates, and shallow trench isolation (STI) region havebeen formed on the substrate such as a silicon substrate.

The photoresist implant mask 20, which masks a large surface area of theintegrated circuit die 10, has small-area openings 22 located at thelower left-hand corner of the integrated circuit die 10. The openings 22expose the substrate surface of the high-voltage (HV) devices such as HVNMOS devices to be doped with a medium-current ion implanter.

Since the high-voltage devices occupy relatively small part of the diearea, the area of the exposed substrate surface through the openings 22is therefore very small, typically about 0.2%˜2% of the die area. It hasbeen found that the small-area openings 22 of the photoresist implantmask 20 during the LDD ion implant process is the root cause of devicedamage such as polysilicon gate bursting.

In light of the above, there is a need to provide an improved method formaking integrated circuits that is able to overcome the above-mentionedLDD doping-related charging damage. Such a method must not, however,introduce any undesired side effects such as decreased deviceperformance or excessively high manufacturing costs.

Please refer to FIG. 2. FIG. 2 is a schematic plan view of layout of aphotoresist implant mask 20 a for implementing LDD regions ofhigh-voltage devices in an integrated circuit die according to onepreferred embodiment of the present invention, wherein like numeralsdesignate like elements, regions or devices.

As shown in FIG. 2, a semiconductor wafer 1 comprises thereon a numberof integrated circuit dies 10 and scribe lanes 12 that separate theintegrated circuit dies 10. A number of test key regions (not explicitlyshown) are defined within the scribing lanes 12. Within the integratedcircuit die 10, device ion wells, gate oxide layer, polysilicon gates,and shallow trench isolation (STI) region have been formed on thesubstrate such as a silicon substrate.

The photoresist implant mask 20 a comprises small-area openings 22 thatexpose the underlying substrate surface of the high-voltage (HV) devicessuch as HV NMOS devices to be doped with a medium-current ion implanter.The exposed substrate surface of the HV devices (hereinafter referred toas “exposed device substrate surface”) through the openings 22 istypically source/drain region isolated by STI. The photoresist implantmask 20 a further comprises dummy openings 24 distributed within the die10 on the rest of the die area. The scribe lanes 12 may be partlymasked. Alternatively, the scribe lanes may be completely clear andopened (not covered by photoresist implant mask 20 a).

The dummy openings 24 are deliberately provided for increasing theexposed substrate surface during the LDD ion implant. According to thepreferred embodiment, the dummy openings 24 expose non-device area ofthe substrate surface (hereinafter referred to as “exposed non-devicesubstrate surface”). For example, these dummy openings 24 may encompassthe STI dummy patterns used to reduce loading effect during thefabrication of STI. The sum of the exposed device substrate surface andthe exposed non-device substrate surface during the LDD ion implantthrough the openings 22 and 24 is preferably larger than 5% of the diearea.

It is advantageous to use the present invention because the additionaldummy openings 24 increase the shunt path current flow through thesubstrate within the integrated circuit die 10, thereby reducing thelikelihood of charging damage to the high-voltage devices during LDD ionimplant.

FIGS. 3–6 are schematic, cross-sectional diagrams showing the method ofreducing charging damage to integrated circuits during semiconductormanufacturing in accordance with the preferred embodiment of the presentinvention. As shown in FIG. 3, the semiconductor substrate 100 comprisesthereon a high-voltage device region 101, a low-voltage device region102, a medium-voltage device region 103, and a STI dummy region 104. STIstructure 110 is formed in the surface of the semiconductor substrate100 to electrically insulate electrical components fabricated on thesurface of the semiconductor substrate 100. Device ion wells such as Pwell or N well are not shown.

Within the high-voltage device region 101, high-voltage MOS transistorssuch as, for example, 5V MOS transistor devices are to be formedtherein. A gate electrode 121 of an exemplary high-voltage NMOStransistor is shown in the high-voltage device region 101. The gateelectrode 121 is stacked on a thick gate oxide layer 131 and isinsulated from the underlying semiconductor substrate 100. Within thelow-voltage device region 102, low-voltage MOS transistors such as, forexample, 1.8V MOS transistor devices are to be formed therein. A gateelectrode 122 of an exemplary low-voltage NMOS transistor is shown inthe low-voltage device region 102. The gate electrode 122 is stacked ona gate oxide layer 132 that is thinner than the gate oxide layer 131 andis insulated from the underlying semiconductor substrate 100. Within themedium-voltage device region 103, medium-voltage MOS transistors suchas, for example, 3.3V MOS transistor devices are to be formed therein.Gate electrodes 123 of three exemplary low-voltage NMOS transistors areformed within the low-voltage device region 103. Each of the gateelectrodes 123 is stacked on a gate oxide layer 133 and is insulatedfrom the underlying semiconductor substrate 100. Within the STI dummyregion 104, a plurality of STI dummy features 124 are provided, aspreviously mentioned, for the sake of loading effect during thefabrication of STI. The plurality of STI dummy features 124 provideexposed semiconductor substrate surface on which no active circuit orelectrical component will be formed.

As shown in FIG. 4, an LDD implant photoresist mask 210 is formed overthe semiconductor substrate 100. The LDD implant photoresist mask 210covers the high-voltage device region 101, the low-voltage device region102 and the STI dummy region 104, while exposing the medium-voltagedevice region 103. Since the medium-voltage device region 103 occupies alarge part of the die area, a large surface area of the semiconductorsubstrate 100 within each die is exposed at this stage. Thesemiconductor substrate 100 is then subjected to an LDD ion implantprocess to implant dopants such as arsenic into the substrate, therebyforming LDD diffusion regions 143 in the medium-voltage device region103. According to the preferred embodiment, in order to provide suitabledosages, the LDD ion implant process is carried out in a medium-currention implanter without employing a plasma flood system or plasma floodgun. The LDD implant photoresist mask 210 is then stripped.

As shown in FIG. 5, another LDD implant photoresist mask 220 is formedover the semiconductor substrate 100. The LDD implant photoresist mask220 covers the medium-voltage device region 103, the low-voltage deviceregion 102, and exposes the high-voltage device region 101. Aspreviously described, since the high-voltage devices occupy relativelysmall part of each die area, the exposed surface area of thehigh-voltage devices during the LDD implant is therefore very small,typically about 0.2%˜2% of the die area. In order to increase theexposed surface area of the semiconductor substrate 100 during the LDDimplant and to reduce charging damage, the STI dummy region 104 and theplurality of STI dummy features 124 are also exposed though the LDDimplant photoresist mask 220.

By doing this, the total exposed surface area of the semiconductorsubstrate 100 within each die increases up to larger than 5% of each diearea. The semiconductor substrate 100 is then subjected to another LDDion implant process to implant dopants such as arsenic into thesubstrate, thereby forming LDD diffusion regions 141 in the high-voltagedevice region 101. According to the preferred embodiment, in order toprovide suitable dosages, this LDD ion implant process is also carriedout in a medium-current ion implanter without employing a plasma floodsystem or plasma flood gun. The LDD implant photoresist mask 220 is thenstripped.

As shown in FIG. 6, still another LDD implant photoresist mask 230 isformed over the semiconductor substrate 100. The LDD implant photoresistmask 230 now covers the medium-voltage device region 103, thehigh-voltage device region 101, and exposes the low-voltage deviceregion 102, and, optionally, the STI dummy region 104. If the exposedsurface area of the high-voltage devices during the LDD implant issmall, for example, less than 5% of the die area, the STI dummy region104 and the plurality of STI dummy features 124 are exposed though theLDD implant photoresist mask 230.

Likewise, the semiconductor substrate 100 is subjected to an LDD ionimplant process to implant dopants such as arsenic into the substrate,thereby forming LDD diffusion regions 142 in the low-voltage deviceregion 102. According to the preferred embodiment, in order to providesuitable dosages, this LDD ion implant process is also carried out in amedium-current ion implanter without employing a plasma flood system orplasma flood gun. The LDD implant photoresist mask 230 is then stripped.The subsequent processes include sidewall spacer formation, heavilydoped source/drain implant, and salicide processes are omitted. It isnoted that the subsequent heavily doped source/drain implant istypically carried out using a high-current ion implanter.

It is to be understood that even the above exemplary embodiments revealthe present invention method of reducing charging damage to integratedcircuits during LDD implant process of high-voltage MOS devices, thisinvention should not be limited thereto. The present invention may beapplied in other applications such as for example plasma etchingprocess. Furthermore, it is noted that the sequence of ion implantingthe high-voltage device region 101, the low-voltage device region 102and the medium-voltage device region 103 may be changed. For example, inaccordance with another preferred embodiment, the LDD regions of thehigh-voltage device region 101 are implanted first.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

1. A method of reducing charging damage to integrated circuits duringsemiconductor manufacturing, comprising: providing a semiconductorsubstrate comprising thereon a number of integrated circuit dies, saidintegrated circuit dies being separated from each other by scribe lanessurrounding each said integrated circuit die, wherein each saidintegrated circuit die comprises thereon at least a first device region,a second device region and a trench isolation dummy region; forming afirst implant mask over said semiconductor wafer, said first implantmask covering said second device region and said trench isolation dummyregion, while exposing said semiconductor substrate within said firstdevice region; implanting dopant species into exposed semiconductorsubstrate within said first device region to form first doping regionstherein; stripping said first implant mask; forming a second implantmask over said semiconductor wafer, said second implant mask coveringsaid first device region, while exposing said semiconductor substratewithin said second device region and a plurality of trench dummyfeatures of said trench isolation dummy region; and implanting dopantspecies into exposed said semiconductor substrate within said seconddevice region to form second doping regions therein.
 2. The methodaccording to claim 1 wherein a first gate electrode is formed withinsaid first device region, and a first gate oxide layer is interposedbetween said first gate electrode and said semiconductor substrate. 3.The method according to claim 1 wherein a second gate electrode isformed within said second device region, and a second gate oxide layerthat is thicker than said first gate oxide layer is interposed betweensaid second gate electrode and said semiconductor substrate.
 4. Themethod according to claim 1 wherein said second device region is ahigh-voltage device region, said second doping regions are lightly dopeddrain (LDD) regions of metal-oxide-semiconductor (MOS) transistordevices to be formed within said high-voltage device region.
 5. Themethod according to claim 4 wherein said MOS transistor devices are NMOStransistor devices.
 6. The method according to claim 1 wherein saidplurality of trench dummy features of said trench isolation dummy regionprovides a part of surface area of said semiconductor substrate withineach said integrated circuit die.
 7. The method according to claim 1wherein the step of implanting dopant species into exposed saidsemiconductor substrate within said second device region to form seconddoping regions therein is carried out using a medium-current ionimplanter.
 8. A method of fabricating integrated circuit, comprising:providing a semiconductor substrate having an integrated circuit diearea surrounded by a scribe lane; simultaneously forming, within saidintegrated circuit die area, a first trench isolation region and asecond trench isolation region on said semiconductor substrate, whereinsaid first trench isolation region isolates a first active device regionfrom a second active device region, and said second trench isolationregion comprises a plurality of trench dummy features for reducingloading effect; forming a first gate electrode on said first activedevice region and a second gate electrode on said second active deviceregion; masking said first active device region, while exposing saidsecond active device region and said plurality of trench dummy featureswithin said second trench isolation region; and performing an ionimplantation process to implant dopant species into said second activedevice region.
 9. The method according to claim 1 wherein said ionimplantation process is carried out using a medium-current ionimplanter.